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Fiberlogy

Fiberlogy ESD ABS 1.75mm -Your Safe Electronics

Regular price
RM 526.85
Sale price
RM 526.85
Regular price
RM 702.46
TDS & SDS Available | RF SOLUTIONS ENTERPRISE E-STORE
TDS & SDS Available
Member Discount | RF SOLUTIONS ENTERPRISE E-STORE
Member Discount
Business Bulk Purchase | RF SOLUTIONS ENTERPRISE E-STORE
Business Bulk Purchase

ESD Fiberlogy filament was created to protect electronic components which are sensitive to electrostatic discharges. The material has high dissipation and antistatic properties with respect to energy coming from discharges, and so it is able to prevent damage or significantly reduce the risk of damage to your electronic devices.

The destructive nature of electrostatic discharge leads to the generation of high costs related to the maintenance, repair and replacement of vulnerable components that companies have to bear, especially those which produce and use electronics in conditions that are conducive to the occurrence of the ESD effect. The task of ESD from Fiberlogy is to eliminate this threat. Therefore, the ESD filament will come in handy when printing housings for integrated circuits, sensors, connectors, measuring devices.

APPLICATION:

* ELECTRONICS: housings, covers, cases, screens products equipped with diodes, connectors

* TOOLS OR THEIR PARTS: tools for working with electronics, tools for making electronic components

* PARTS AND TRANSMISSION TOOLS: machine components, elements of equipment for employees and manufacturing plants

Properties:

  • high resistance to electrostatic discharge and chemicals
  • high impact strength
  • resistance to high temperatures and scratching
  • possibility of mechanical and chemical processing

DIAMETER

1.75 MM

DIAMETER TOL

+/- 0.02 mm

OVAL TOL

+ 0.01 mm

PRINTING TEMP

250 -265°C

TABLE TEMP

90-110°C

HOW TO PRINT?

The following parameters are only suggested print settings for this material. To ensure the best print quality, it is necessary to choose the appropriate settings for a specific printer and printing conditions.

NOZZLE TEMPERATURE

250-265°C

BED TEMPERATURE

90-110°C

CLOSED CHAMBER

recommended

FAN

0-10%

FLOWRATE

95-105%

PRINTING SPEED

35-60 mm/s

SURFACE

glass, masking tape

RETRACTION (DIRECT)

2-3 mm

RETRACTION (BOWDEN)

4-6 mm

RETRACTION SPEED

20-45 mm/s

===Authorozed Fiberlogy Reseller Malaysia===